Lieu d'origine: | Changhaï |
Nom de marque: | SIGNI |
Détails d'emballage: | Carton |
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Conditions de paiement: | T/T, L/C, PAYPAL, UNION OCCIDENTALE |
Surligner: | 6μm Diamond Slurry Polishing,SiC Diamond Slurry Polishing,6μm diamond lapping slurry |
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Characteristics:
★ Fine polycrystalline diamond materials.
★ Superhigh cutting force and surface finish in the processing of high hardness wafers.
★ Different carriers are suitable for different fields.
Available Sizes:
Size(μm)
|
0.25
|
0.5
|
1
|
3
|
4
|
6
|
Media
|
Water/Oil
|
Water/Oil
|
Water/Oil
|
Water/Oil
|
Water/Oil
|
Water/Oil
|
Remarks: Special sizes can be tailor-made.
Applications:
1.Semiconductor wafer processing: such as sapphire substrate, SiC wafer and sapphire window film.
2.Ceramic processing: such as Zirconia fingerprint identification chip, Zirconia ceramic mobile phone back cover and other functional ceramics.
3. Metal processing: such as stainless steel, die steel, aluminum alloy and other metal materials.
Personne à contacter: Zhao
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